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| 标题 | An Overview Of System In Package (SiP) Applications And Technologies For Cpu And Communications Systems |
| 网址 | |
| DOI | 10.1115/ipack2005-73320 |
| 其他 | 期刊：Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005 作者：L. Polka;R. Mahajan;J. Swan;G. Choksi 出版日期：2005 |
| 求助人 | 把阳光剪成窗纸贴在心口 在 2023-10-13 00:25:04 发布，悬赏 |
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