【已完结】 Grain Size And Cap Layer Effects On Electromigration Reliability Of Cu Interconnects: Experiments And Simulation 搜知猫 - 外文文献互助服务平台

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标题	Grain Size And Cap Layer Effects On Electromigration Reliability Of Cu Interconnects: Experiments And Simulation
网址	https://doi.org/10.1063/1.3527136
DOI	10.1063/1.3527136
其他	期刊：AIP Conference Proceedings 作者：L. Zhang;M. Kraatz;O. Aubel;C. Hennesthal;E. Zschech;P.S. Ho 出版日期：2010
求助人	占有欲﹪ 在 2023-09-30 01:30:34 发布，悬赏 10 积分
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