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| 标题 | Grain Size And Cap Layer Effects On Electromigration Reliability Of Cu Interconnects: Experiments And Simulation |
| 网址 | |
| DOI | 10.1063/1.3527136 |
| 其他 | 期刊：AIP Conference Proceedings 作者：L. Zhang;M. Kraatz;O. Aubel;C. Hennesthal;E. Zschech;P.S. Ho 出版日期：2010 |
| 求助人 | 占有欲﹪ 在 2023-09-30 01:30:34 发布，悬赏 |
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